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Apple Computing Products:
macOS - Notebook Hardware
Using my MBP makes me sweaty and uncomfortable =(
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<blockquote data-quote="Geeky1" data-source="post: 498882" data-attributes="member: 34442"><p>The Core architecture is considerably less power hungry than the PPC970FX (the G5), particularly as the speed of the G5 slides up past 2GHz; there's an old IBM whitepaper which I can't find at the moment that showed the TDP and vCore requirements for the 970 increasing dramatically as clock speeds pushed beyond 2GHz.</p><p></p><p>It's a different story though, when the C2D is compared to the 74xx series (G4). The G4 is a far simpler CPU with far, far fewer transistors. They don't put out a lot of heat at all. In fact, the oldest G4s (a 450 and a 466, in the case of the following example) run so cool that it's possible to boot a machine with one into OSX and let it idle for several minutes while using your finger as a heatsink. They're not very power hungry. Tradeoff is they're also much slower than the Core2, clock-for-clock.</p><p></p><p>As far as the cooling system goes... heatpipes are *extremely* effective. Yes, flattened ones like those used in the MBP (and most other notebooks) can be less efficient than perfectly round ones because the squished cross-section can cause the wick structure inside the heatpipe to interfere with the flow of the working fluid to the cold end of the pipe, but even with that drop in efficiency, they're far more effective than say, a solid metal plate would be. </p><p></p><p>Given the results-both good and bad-that people have had with reapplying thermal compound, it's unlikely (inconceivable, in fact, to my way of thinking) that the cause of the high temperatures MBPs tend to run at lies in the heatsink itself.</p></blockquote><p></p>
[QUOTE="Geeky1, post: 498882, member: 34442"] The Core architecture is considerably less power hungry than the PPC970FX (the G5), particularly as the speed of the G5 slides up past 2GHz; there's an old IBM whitepaper which I can't find at the moment that showed the TDP and vCore requirements for the 970 increasing dramatically as clock speeds pushed beyond 2GHz. It's a different story though, when the C2D is compared to the 74xx series (G4). The G4 is a far simpler CPU with far, far fewer transistors. They don't put out a lot of heat at all. In fact, the oldest G4s (a 450 and a 466, in the case of the following example) run so cool that it's possible to boot a machine with one into OSX and let it idle for several minutes while using your finger as a heatsink. They're not very power hungry. Tradeoff is they're also much slower than the Core2, clock-for-clock. As far as the cooling system goes... heatpipes are *extremely* effective. Yes, flattened ones like those used in the MBP (and most other notebooks) can be less efficient than perfectly round ones because the squished cross-section can cause the wick structure inside the heatpipe to interfere with the flow of the working fluid to the cold end of the pipe, but even with that drop in efficiency, they're far more effective than say, a solid metal plate would be. Given the results-both good and bad-that people have had with reapplying thermal compound, it's unlikely (inconceivable, in fact, to my way of thinking) that the cause of the high temperatures MBPs tend to run at lies in the heatsink itself. [/QUOTE]
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Apple Computing Products:
macOS - Notebook Hardware
Using my MBP makes me sweaty and uncomfortable =(
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