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Quick technical question about the heatsink in the MBP (I'm formulating a theory for the review I'm in the process of getting around to getting ready to get around to writing... *rolls eyes*)
It looks to me, from the literature that I've read, like there is no real-for lack of a better term-direct mechanical connection between the board and the heatsink. That is, as I understand it, the heatsink is attached to the bottom case, and the board essentially rests on top of it. There are no springs, no bolts, no clips, nothing that put pressure on the joint between the chips and the heatsink, correct?
Or am I mistaken?
Thanks.
It looks to me, from the literature that I've read, like there is no real-for lack of a better term-direct mechanical connection between the board and the heatsink. That is, as I understand it, the heatsink is attached to the bottom case, and the board essentially rests on top of it. There are no springs, no bolts, no clips, nothing that put pressure on the joint between the chips and the heatsink, correct?
Or am I mistaken?
Thanks.